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CoreModule 730 Reference Manual 1
Chapter 1 About This Manual
Purpose of this Manual
This manual is for designers of systems based on the CoreModule™ 730 stackable single board computer
(SBC) module. This manual contains information that permits designers to create embedded systems based
on specific design requirements.
Information provided in this reference manual includes:
CoreModule 730 SBC Specifications
Environmental requirements
Major chips and features implemented
CoreModule 730 SBC connector/pin numbers and definitions
BIOS Setup information
Information not provided in this reference manual includes:
Detailed chip specifications
Internal component operation
Internal registers or signal operations
Bus or signal timing for industry standard busses and signals
References
The following list of references may be helpful for you to complete your custom design successfully. Some
of these references are also available on the ADLINK’s InfoCenter web page. The InfoCenter was created
for embedded system developers to share ADLINK’s knowledge, insight, and expertise.
Specifications
SUMIT Specification Revision 1.0, April 4, 2008
Web site: http://www.sff-sig.org/sumit_spec_v10.pdf
ISM Specification Revision 1.0, June, 2008
Web site: http://www.sff-sig.org/ism_spec_v10.pdf
PCI 2.2 Specification Revision 2.2, December 18, 1998
Web site: http://www.pcisig.com
Major Integrated Circuit (IC) Specifications
The following chip specifications are used in the CoreModule 730 processor module:
Intel Corporation and the Atom processor chip
Web site: http://download.intel.com/design/processor/datashts/319535.pdf
Intel Corporation and the US15W System Controller Hub (SCH)
Web site: http://download.intel.com/design/chipsets/embedded/datashts/319537.pdf
Analog Devices and the ADM1032ARMZ-1 CPU Temperature Monitor
Web site: http://www.analog.com/static/imported-files/data_sheets/ADM1032.pdf
Chrontel and the SDVO to RGB Converter
Web site: http://www.chrontel.com/pdf/7317ds.pdf
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