ADLINK Technology MXE-5104M Manual de usuario descargar pdf (Pagina 4)

Complete Consideration for Heat Dissipation

Mechanical and electrical engineers worked from the early design stages of the Matrix to ensure the

best conductive heat dissipation performance possible. All components, such as the CPU, chipset,

memory, clock generator, MOSFET, and power choke, etc. generate heat and are thus placed on the

top of the PCB and kept at a minimal distance from the aluminum case. Thus the shortest path of

heat conduction and lowest thermal resistance can be provided to guarantee the thermal stability of

the Matrix at a 70°C ambient temperature.

Cable-Free and User-friendly Mechanical Structure

The Matrix features an excellent cable-less design. All components and connectors are directly

mounted on the PCB via SMT and DIP processes instead of cable connections. The result is an

extremely strong and durable mechanical structure suitable for the harshest of environments. The

Matrix MXC series—being an expandable embedded computer—also provides a very user-friendly

design for system installation. You can open the chassis and install your PCI/PCIe card simply by

loosening one screw. And, only four screws are used to access the hard disk drive. This mechanical

design provides high reliability and durability and easy access for installation and maintenance.

*This option guarantees cold boot of the system at -20°C and operation with 100% loading at 70°C.

The industrial solid-state drive storage option is required. Heat dissipation from inserted PCI/PCIe cards may affect thermal performance.

Facility Management Video Surveillance/

Recognition

Electrical Substation Intelligent Transportation

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ADLINK Technology MXE-5104M Manual de usuario Pagina 4