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MiniModule SIO Reference Manual 1

Chapter 1 About This Manual

Purpose

This manual provides technical information to allow embedded system designers to expand their embedded

systems.

Information provided in this manual includes:

• MiniModule SIO board specifications

• Environmental requirements

• Major Integrated Circuit (IC) definitions

• MiniModule SIO board header and connector definitions

Information not provided in this manual includes:

• Detailed chip specifications

• Internal component operation

• Internal registers or signal operations

• Bus or signal timing for industry standard busses and signals

• Industry standard connector pinout tables

References

The following list of references may help you successfully complete your design.

Specifications

• LPC Specification Revision 1.1, August, 2002

Web site: http://www.intel.com/design/chipsets/industry/25128901.pdf

• MiniBlade Specification Revision 1.00, March 6, 2009

Web site: http://www.sff-sig.org/miniblade.html

• SUMIT Specification Revision 1.4, May 14, 2009

Web site: http://www.sff-sig.org/sumit_spec_v10.pdf

• PC/104 Specification Revision 2.5, November 2003

Web site: http://www.pc104.org

Major Integrated Circuit (ICs) Specifications:

• Fintek, Inc. and the LPC-to-ISA Bridge, F85226FG

Web site: http://www.fintek.com.tw/files/productfiles/F85226AF_V020P.pdf

• SMSC, Inc. and the LPC Super I/O, SCH3114I-NU

Web site: http://www.smsc.com/media/Downloads_Public/Data_Briefs/311xdb.pdf

• Maxim Integrated Products and the RS-232 Transceiver, MAX213EEAI

Web site: http://datasheets.maxim-ic.com/en/ds/MAX202E-MAX241E.pdf

• Linear Technology and the RS-422/485 Transceiver, LTC1334CG#PBF

Web site: http://cds.linear.com/docs/Datasheet/1334fa.pdf

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ADLINK Technology CoreModule 730 Manual de usuario Pagina 5